Molded and Processed Heat-Resistant Organic Laminated Board PGE-6771
High mechanical strength not found in inorganic systems! You can gain benefits such as energy savings and improved yield.
This is a laminated board that has been improved with our unique technology to enhance strength and heat resistance. Its greatest feature is the high mechanical strength that is not found in inorganic materials. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 200 Compression creep rate (%): 0.12 Bending strength (MPa): 450–540 Compression strength (MPa): 500–580 Impact strength (J/cm): >4.5 Thermal expansion rate (1/°C): 6.5×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^14 Water absorption rate: 0.05 Specific gravity: 1.8–1.9 We perform precision machining of PGE-6771 using numerous machine tools in a temperature-controlled environment for 24 hours. *For more details, please refer to the PDF document or feel free to contact us.
- Company：三田電気工業
- Price：Other
